SPEA’s test cells for smart card modules are designed to integrate, on a single equipment, the reel-to-reel handling of the devices, the complete parametric testing, and the high-resolution 2D/3D optical testing. All of this is provided in a compact footprint, and controlled through a unique, friendly software environment.
The unique feature of the integrated test cell is the capability to detect all the possible process defects on the devices: electrical, physical, mechanical.
The 3D optical test units
detects all the defects due to the tape burr that can occur after the reject punching unit
The 2D optical test units
Inspect the tape surface, detecting errors in the layout, hole position, scratches, imprints, bubbles
The measurement unit
performs the complete electrical test of the devices
Additionally to the standard parametric tests (open, short, leakage), the measurement unit can also perform the ultra-accurate measure of capacitance/inductance on RFID devices (verifying the input signal before assembly), the test of passive devices (e.g. capacitors, resistors, resonators), the final functional test of the communication with standard or customized protocols, the working distance test for RFID devices, and the measure of the signal clearness and strength.
SPEA Smart Card Test Cell